Integrated wafer processing system for integration of...

Details Integrated wafer processing system for integration of... Integrated wafer processing system for integration of...

2007-07-17

2010-10-12

Landau, Matthew C (Department: 2813)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257SE21497, C392S416000

Reexamination Certificate

active

07811923

ABSTRACT:
The present disclosure relates to an integrated wafer processing apparatus for fabricating semiconductor chips. This integrated wafer processing system combines the lithography patterning steps and irradiation curing steps of the patternable dielectric into one system. The patternable low-k material of the present disclosure also functions as a photoresist, i.e. is a photo-patternable low-k dielectric material.

REFERENCES:
patent: 6051282 (2000-04-01), Konjuh et al.
patent: 6838115 (2005-01-01), Kumar et al.
patent: 2003/0113974 (2003-06-01), Ning et al.
patent: 2004/0151893 (2004-08-01), Kydd et al.
patent: 2005/0116357 (2005-06-01), Fitzsimmons et al.
Low Dielectric Constant SILK films as Bottom Antireflective Coating Layers for both KrF and ArF lithography, Microprocesses and Nanotechnology Conference, 2001 International pp. 132-133.

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