Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2006-05-22
2008-11-11
Zarneke, David A (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S717000, C257SE23080, C257SE23101
Reexamination Certificate
active
07449775
ABSTRACT:
A decoupling package stack including a circuit board, a substrate mounted on and electrically coupled to the circuit board, a semiconductor die mounted on and electrically coupled to the substrate a deformable elastomeric support mounted on the substrate, one or more mounts coupled to the circuit board and a heatsink. The heatsink includes a contoured heatsink base having a spacer attached thereto, the spacer operable to determine and maintain a desired bondline of a first thermal interface material (TIM) between the semiconductor die and the contoured heatsink base. The heatsink also includes one or more contact portions for contacting the deformable elastomeric support and one or more compressing surfaces coupled to the one or more mounts. A method for assembling a decoupling package stack.
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Martine & Penilla & Gencarella LLP
Sun Microsystems Inc.
Zarneke David A
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