Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1997-11-14
2000-03-07
Whitehead, Jr., Carl
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257712, 257713, 257714, 257717, 257720, 257724, 361679, 361688, 361697, 361702, 361707, 361713, 361714, H01L 2334
Patent
active
06034430&
ABSTRACT:
In order to provide a thermal coupling between a heat source and a heat sink, an integrated interleaved-fin connector is provided. A first substrate includes a first side surface and a second side surface. A plurality of heat generating devices are formed in the first side surface. A plurality of first channels are etched in the second side surface to form a plurality of first fins. A second substrate has a plurality of second channels etched therein to form a plurality of second fins and a base. The base is for thermally engaging with a heat sink. The first and second fins providing a thermally conductive path from the heat generating devices to the heat sink when interleaved with each other.
REFERENCES:
patent: 4800956 (1989-01-01), Hamburgen
patent: 5083373 (1992-01-01), Hamburgen
patent: 5838065 (1998-11-01), Hamburgen et al.
IEEE, 1991, 0569-5503/91/0000-0693, "Hardware Technology for Hitachi M-880 Processor Group", F. Kobayashi t al [1991 Proceedings of the 41st Electronic Components & Technology Conference, Atlanta, Georgia], pp. i-13.
"Interleaved Fin Thermal Connectors for Multichip Modules", W. Hamburgen, WRL Research Report 91/9, Aug. 1991, Digital Equipment Corporation, Western Research Lab, 250 University Ave., Palo Alto, California 94301 USA, pp. 1-8.
Fitch John S.
Hamburgen William R.
Digital Equipment Corporation
Jr. Carl Whitehead
Warren Matthew E.
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