Integrated test circuits having pads provided along scribe lines

Details Integrated test circuits having pads provided along scribe lines Integrated test circuits having pads provided along scribe lines

1993-01-22

1994-02-08

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Test or calibration structure

257620, 257786, H01L 2166, H01L 2704, G01R 3126

Patent

active

052850820

ABSTRACT:
Integrated circuits sometimes include, in addition to the connection surfaces provided for normal operation, additional test pads through which test signals can be put in or read out during testing on the wafer. These connection pads require additional space on the semiconductor slice, so that fewer circuits can be accommodated on a semiconductor slice of a given size. It is proposed to provide the test pads in a row at one or two sides of the circuit and connect them with two adjoining circuits. The cut for separating the chips after manufacture and the test can then take place through these test pads, so that the latter require only little extra space. Advantageously, adjoining circuits will have layouts which are one another's mirrored images.

REFERENCES:
patent: 5003374 (1991-03-01), Vokoun, III
patent: 5047711 (1991-09-01), Smith et al.
patent: 5051807 (1991-09-01), Morozumi

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