Integrated substrate processing in a vacuum processing tool

Details Integrated substrate processing in a vacuum processing tool Integrated substrate processing in a vacuum processing tool

2006-09-26

2011-10-11

Meeks, Timothy (Department: 1715)

Coating processes

Coating by vapor, gas, or smoke

C427S255230, C427S255700, C204S192100, C204S192110

Reexamination Certificate

active

08034406

ABSTRACT:
A method and system are provided for integrated substrate processing in Cu metallization. The method includes providing a substrate in a vacuum processing tool containing a plurality of processing systems configured to process the substrate and a substrate transfer system configured to transfer the substrate under vacuum conditions between the plurality of processing systems, and performing an integrated deposition process on the substrate. The plurality of processing systems and the substrate transfer system maintain a base pressure of background gases at 6.8×10−8Ton or lower, preferably 5×10−8Torr or lower, during the integrated deposition process. According to one embodiment, the integrated process includes depositing a barrier metal layer on the substrate, and depositing a Cu layer on the barrier metal layer. According to another embodiment, the integrated process further includes depositing a Ru layer on the barrier metal layer, and depositing a Cu layer on the Ru layer.

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