Excavating
Patent
1992-11-10
1994-03-08
Canney, Vincent P.
Excavating
371 103, 365201, G11C 700
Patent
active
052933865
ABSTRACT:
An integrated semiconductor memory includes a parallel test device and block groups. The parallel test device is used for writing in and evaluating data to be written into and read out of the semiconductor memory. Several groups of memory cells can be simultaneously tested for operation in a test mode, with each group being disposed along a respective word line. The data read out during the process can be evaluated by the parallel test device. The result of the evaluation is present, separately for each group of memory cells, on I/O data lines of the semiconductor memory. The semiconductor memory can also have redundant memory cells, in which case defective memory cells or groups of memory cells can be replaced in connection with the test mode.
REFERENCES:
patent: 4464750 (1984-08-01), Tatematsu
patent: 4541090 (1985-09-01), Shiragasawa
patent: 4742489 (1988-05-01), Hoffmann
patent: 4742490 (1988-05-01), Hoffmann
patent: 4803656 (1988-02-01), Takemae
patent: 4862416 (1989-08-01), Takeuchi
patent: 5075892 (1991-12-01), Choy
patent: 5157664 (1992-10-01), Waite
IEEE Trans. on Computers, (1989) Mar., No. 3, New York, US, Pinaki Mazumder and Janak K. Patel: "Parallel Testing for Pattern-Sensitive Faults in Semiconductor Random-Access Memories".
Muhmenthaler Peter
Oberle Hans D.
Peisl Martin
Savignac Dominique
Canney Vincent P.
Greenberg Laurence A.
Lerner Herbert L.
Siemens Aktiengesellschaft
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