Integrated optical MEMS devices

Details Integrated optical MEMS devices Integrated optical MEMS devices

2007-07-03

2007-07-03

Ahmed, Shamim (Department: 1765)

Semiconductor device manufacturing: process

Chemical etching

Liquid phase etching

C216S002000, C216S024000, C216S041000, C216S083000, C216S099000, C438S750000, C438S753000

Reexamination Certificate

active

11130904

ABSTRACT:
A method for fabricating an optical device and micromechanical device, wherein both devices are monolithically-integrated with a substrate. The optical surfaces and micromechanical devices are each formed in an etch step that is well-suited for forming that device. In addition, the embodiments of the present invention enable the optical surface and micromechanical device to be fabricated irrespective of severe topography on the surface of the substrate.

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Yun, et al., “Fab of Vert. Opt. Plane using DRIE and KOH Cryst. Etch. of (110) Si Wafer”, IEEE/LEOS Int. Conf. on Opt. MEMS, Aug. 2004, pp. 128-129, Takamatsu, Kagawa, Japan.
Yu, et al. “Var. BW Opt. Filts. w/Vert. Micromirrors and Si Opt. Bench Align. Tech.,” IEEE/LEOS Int. Conf. on Opt. MEMS, Aug. 2004, pp. 531-532, Takamatsu, Kagawa, Japan.
Li, et al., “Tunable Opt. Wavelength Deinterleaver based on Tunable MEMS Blazed Gratings,” 17th IEEE/LEOS Annual Meeting, Nov. 2004, pp. 320-321, Puerto Rico.

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