Integrated micro electromechanical system encapsulation...

Details Integrated micro electromechanical system encapsulation... Integrated micro electromechanical system encapsulation...

2007-01-09

2007-01-09

Andujar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With window means

C257S434000

Reexamination Certificate

active

10725084

ABSTRACT:
The component comprises micro electromechanical systems integrated in a cavity of a substrate and a cover sealed onto the substrate and designed to make the cavity hermetic. The cover comprises at least one groove passing through the cover and defining a central zone completely covering the cavity and a peripheral zone in the cover. A sealing material is deposited at least at the bottom of the groove. Fabrication of the component can comprise a first stage of making at least one groove in the cover, a second stage of bringing the substrate and cover into contact, and a third stage of sealing by depositing a sealing material in the bottom of the groove.

REFERENCES:
patent: 1 070 677 (2001-01-01), None
patent: 1 071 126 (2001-01-01), None
patent: 1 167 281 (2002-01-01), None
patent: WO 01/29529 (2001-04-01), None

Affiliated with

Also associated with

Rating

Integrated micro electromechanical system encapsulation... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated micro electromechanical system encapsulation..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated micro electromechanical system encapsulation... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3730229