Integrated MEMS packaging

Details Integrated MEMS packaging Integrated MEMS packaging

2007-05-15

2007-05-15

Le, Dung A. (Department: 2818)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S048000, C438S508000

Reexamination Certificate

active

11178148

ABSTRACT:
An integrated MEMS package and associated packaging method are provided. The method includes: forming an electrical circuit, electrically connected to the first substrate; integrating a MEMS device on a first substrate region, electrically connected to the first substrate; providing a second substrate overlying the first substrate; and, forming a wall along the first region boundaries, between the first and second substrate. In one aspect, the electrical circuit is formed using thin-film processes; and, wherein integrating the MEMS device on the first substrate region includes forming the MEMS using thin-film processes, simultaneous with the formation of the electrical device. Alternately, the MEMS device is formed in a separate process, attached to the first substrate, and electrical interconnections are formed to the first substrate using thin-film processes.

REFERENCES:
patent: 6400009 (2002-06-01), Bishop et al.
patent: 6624033 (2003-09-01), Noble
patent: 6803127 (2004-10-01), Su et al.

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