Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-04-19
2005-04-19
Chervinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S709000, C361S719000, C257S706000, C165S185000
Reexamination Certificate
active
06882535
ABSTRACT:
A downset edge integrated heat spreader is disclosed. The downset edge can be formed to an industrially accepted flatness with a single stamping operation. The downset edge can provide a surface for fastening the downset edge integrated heat spreader to a mounting substrate. The downset edge can also provide a component recess for mounting a component near a processor, but on the mounting substrate. The downset edge can also provide a warp and bend resistant structure during ordinary field use.
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Houle Sabina J.
Labanok Nick
Chervinsky Boris
Intel Corporation
Schwegman Lundberg Woessner & Kluth P.A.
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