Integrated heat sink

Details Integrated heat sink Integrated heat sink

1998-09-29

2000-06-27

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257706, H01L 2310, H01L 2334

Patent

active

060810270

ABSTRACT:
A semiconductor device has an integrated heat sink. A package body encapsulates a die and a leadframe. A heat sink is in thermal contact with the die and the leadframe. The heat sink is encapsulated in the package body. The heat sink has a connector (e.g., a threaded connection, a conductive adhesive layer) for attachment to an external heat sink.

REFERENCES:
patent: 4612601 (1986-09-01), Watari
patent: 5055914 (1991-10-01), Shimizu et al.
patent: 5227663 (1993-07-01), Patil
patent: 5276586 (1994-01-01), Hatsuda et al.
patent: 5397919 (1995-03-01), Tata et al.
patent: 5444909 (1995-08-01), Mehr
patent: 5667870 (1997-09-01), McCullough
patent: 5719442 (1998-02-01), Otsuki
patent: 5773886 (1998-06-01), Rostoker et al.
patent: 5917703 (1999-06-01), Murphy
patent: 5945736 (1999-08-01), Rife et al.

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