Integrated flexible interconnection

Details Integrated flexible interconnection Integrated flexible interconnection

1998-05-28

2000-08-22

Tran, Andrew

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438613, 438614, 438615, 438108, 438118, 438459, H01L 2144

Patent

active

06107179&

ABSTRACT:
A method of creating a plurality of fine pitch integrated interconnects utilizes a flexible layer to create a plurality of integrated interconnects which extend beyond the boundary of the integrated circuit chip onto the substrate. Subsequently, a support layer is deposited on the interconnects and the substrate under the plurality of interconnects which is located beyond the boundary of the integrated circuit chip is removed.

REFERENCES:
patent: 3747202 (1973-07-01), Jordan
patent: 3805376 (1974-04-01), D'Asaro et al.
patent: 3925880 (1975-12-01), Rosvold
patent: 3947952 (1976-04-01), Miller et al.
patent: 3997963 (1976-12-01), Riseman
patent: 4783695 (1988-11-01), Eichelberger et al.
patent: 5452182 (1995-09-01), Eichelberger et al.

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