Integrated die bumping process

Details Integrated die bumping process Integrated die bumping process

2007-07-10

2007-07-10

Le, Thao P. (Department: 2818)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257SE21518, C257S779000, C438S613000

Reexamination Certificate

active

10905490

ABSTRACT:
An integrated die bumping process includes providing a load board, defining a plurality of die regions on a surface of the load board for placing dice of a plurality of die specifications, affixing a plurality of dice respectively on the die regions according to the plurality of die specifications, and performing a die bumping process.

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