Integrated devices including cleaved semiconductor lasers

Details Integrated devices including cleaved semiconductor lasers Integrated devices including cleaved semiconductor lasers

1985-05-14

1987-11-17

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156645, 156655, 1566591, 156662, 357 17, 357 30, 372 50, 437225, H01L 21306, B44C 122, C03C 1500, C03C 2506

Patent

active

047072199

ABSTRACT:
A new technique called stop cleaving permits semiconductor lasers having etched mirrors to be fabricated on a common substrate with other optical or electronic components such as photodetectors and field-effect transistors.

REFERENCES:
patent: 3341937 (1967-09-01), Dill
patent: 3457633 (1969-07-01), Marinace et al.
patent: 4354898 (1982-10-01), Coldren et al.
Applied Physics Letters, 41, 1982, p. 126.
IEEE Journal of Lightwave Technology, LT-1, 1983, p. 261.

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