Integrated device and electronic system

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reexamination Certificate

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Details

C257S738000, C257SE23021, C257SE23069, C257SE21508, C438S613000, C438S614000, C438S615000, C438S616000, C438S617000

Reexamination Certificate

active

11086922

ABSTRACT:
The present invention relates to an integrated device comprising an electronic circuit chip, a solder contact structure to provide contact to the electronic circuit chip and an elastic contact structure to provide contact to the electronic circuit chip, wherein the solder contact structure and the elastic contact structure are arranged on a contacting surface of the integrated device.

REFERENCES:
patent: 6177729 (2001-01-01), Benenati et al.
patent: 2002/0100610 (2002-08-01), Yasuda et al.

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