Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2007-05-22
2007-05-22
Clark, Jasmine (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S738000, C257SE23021, C257SE23069, C257SE21508, C438S613000, C438S614000, C438S615000, C438S616000, C438S617000
Reexamination Certificate
active
11086922
ABSTRACT:
The present invention relates to an integrated device comprising an electronic circuit chip, a solder contact structure to provide contact to the electronic circuit chip and an elastic contact structure to provide contact to the electronic circuit chip, wherein the solder contact structure and the elastic contact structure are arranged on a contacting surface of the integrated device.
REFERENCES:
patent: 6177729 (2001-01-01), Benenati et al.
patent: 2002/0100610 (2002-08-01), Yasuda et al.
Dobritz Stephan
Hedler Harry
Meyer Thorsten
Clark Jasmine
Infineon - Technologies AG
Patterson & Sheridan L.L.P.
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