Integrated connection arrangements

Details Integrated connection arrangements Integrated connection arrangements

2011-06-21

2011-06-21

Bryant, Kiesha R (Department: 2891)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257SE21508

Reexamination Certificate

active

07964494

ABSTRACT:
A connection arrangement having an outer conductive structure arranged at least partly or completely in a cutout of an electrical insulation layer is provided. An inner conductive structure is arranged at the bottom of the cutout on one side of the insulation layer. The inner conductive structure adjoins the outer conductive structure in a contact zone. A contact area is arranged at the outer conductive structure on the other side of the cutout. The contact zone and the contact area do not overlap. The bottom of the cutout is arranged to overlaps at least half of the contact area, to provide a step in the insulation layer at the edge of the cutout outside a main current path between the contact area and the inner conductive structure.

REFERENCES:
patent: 5248903 (1993-09-01), Heim
patent: 5250760 (1993-10-01), Kano
patent: 5621246 (1997-04-01), Motoyama
patent: 6451681 (2002-09-01), Greer
patent: 6649509 (2003-11-01), Lin et al.
patent: 6890828 (2005-05-01), Horak et al.
patent: 7361993 (2008-04-01), Coolbaugh et al.
patent: 7619309 (2009-11-01), Drexl et al.
patent: 2002/0006717 (2002-01-01), Yamaha
patent: 2002/0016070 (2002-02-01), Friese
patent: 2002/0053740 (2002-05-01), Stamper et al.
patent: 2003/0047794 (2003-03-01), Watanabe
patent: 2005/0001314 (2005-01-01), Tanaka et al.
patent: 2006/0006552 (2006-01-01), Kang et al.

Affiliated with

Also associated with

Rating

Integrated connection arrangements does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated connection arrangements, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated connection arrangements will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2729126