Integrated circuits having metallic fuse links

Details Integrated circuits having metallic fuse links Integrated circuits having metallic fuse links

1998-06-16

1999-08-10

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

Passive components in ics

H01L 2900

Patent

active

059362960

ABSTRACT:
An integrated circuit includes a metallic fuse link blown by a laser beam which may enhance the long term reliability of the metallic fuse link. The integrated circuit includes an insulating layer formed on a semiconductor substrate. First and second metal wiring layers each with an end surface and an upper surface are located on the insulating layer. The first and second metal wiring layers are arranged so that the end surface of each metal wiring layer faces the other metal wiring layer. A metallic fuse layer is located on the upper surfaces of the metal wiring layers, on the end surfaces of the metal wiring layers and therebetween to define a metallic fuse link.

REFERENCES:
patent: 4536949 (1985-08-01), Takayama et al.
patent: 4794568 (1988-12-01), Lim et al.
patent: 4829480 (1989-05-01), Seo
patent: 5025300 (1991-06-01), Billig et al.
patent: 5070392 (1991-12-01), Coffey et al.
patent: 5185291 (1993-02-01), Fischer et al.
patent: 5241212 (1993-08-01), Motonami et al.
patent: 5244836 (1993-09-01), Lim
patent: 5297085 (1994-03-01), Choi et al.
patent: 5374590 (1994-12-01), Batdorf et al.
patent: 5578517 (1996-11-01), Yoo et al.
patent: 5672905 (1997-09-01), Lee et al.
patent: 5813881 (1998-09-01), Nathan et al.

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