Integrated circuitry comprising insulative collars and...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S758000, C257S774000

Reexamination Certificate

active

06861713

ABSTRACT:
A method of forming a conductive contact to a conductive structure includes forming a conductive structure received within and projecting outwardly from a first insulative material. A second different insulative material is deposited. The second insulative material is anisotropically etched effective to form a sidewall etch stop for the conductive structure. A third insulative material is deposited over the conductive structure and the sidewall etch stop. The third insulative material is different in composition from the second insulative material. A contact opening is etched through the third insulative material to the conductive structure using an etch chemistry which is substantially selective to the second insulative material of the sidewall etch stop. Integrated circuitry independent of the method of fabrication is disclosed.

REFERENCES:
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patent: 6080621 (2000-06-01), Wang et al.
patent: 6168989 (2001-01-01), Chiang et al.
patent: 6194313 (2001-02-01), Singh et al.
patent: 6239022 (2001-05-01), Seo et al.
patent: 6380042 (2002-04-01), Huang
patent: 6476488 (2002-11-01), Jeng et al.
patent: 6566241 (2003-05-01), Chun
patent: 20020110975 (2002-08-01), Parckh et al.

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