Integrated circuit with reduced coupling via the substrate

Details Integrated circuit with reduced coupling via the substrate Integrated circuit with reduced coupling via the substrate

2006-01-03

2006-01-03

Pham, Long (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Field effect device

Having insulated electrode

C257S356000, C257S357000

Reexamination Certificate

active

06982463

ABSTRACT:
The integrated circuit includes a substrate SB incorporating a plurality of electronic components C1, C2and a seal ring SR around the electronic components. It includes cold spot means VM, PG, BDG disposed between the electronic components and the seal ring. It further includes electrostatic discharge protection means including an electrostatic discharge rail VM around the electronic components and constituting said cold spot means.

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