Integrated circuit with lead frame package having internal power

Details Integrated circuit with lead frame package having internal power Integrated circuit with lead frame package having internal power

1997-06-27

2000-09-05

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257668, 257691, H01L 23495

Patent

active

061147494

ABSTRACT:
An integrated circuit includes a semiconductor integrated circuit chip housed in a package providing external electrical connections for the circuit chip. The package has only a limited number of external connections available for such use. The package includes an internal buss, or plurality of busses, which are electrically connected to the circuit chip and to selected external connections of the package to improve the efficiency of utilization of external connections on the package, as well as improving operating characteristics of the integrated circuit chip by improvements to voltage and current distributions to the chip, and also eliminating in some cases the consequences of a poor quality of external electrical connection to the package itself.

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