Integrated circuit with improved overvoltage protection

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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Details

257355, 257361, 257363, H01L 2362

Patent

active

059172207

ABSTRACT:
A special rail is provided along each edge of an integrated circuit chip with bias circuits connected to the ends of each special rail. The bias circuits charge the special rail to the V.sub.DD voltage level during normal operation, and clamp the special rail to the V.sub.SS rail upon the occurrence of an overvoltage event. Input bonding pads are provided along each edge of the chip and are connected through diodes to the special rail so that 5 volt signals applied to the input bonding pads do not cause damage to the device when operated from a 3.3 volt supply. A signal line of extended length is provided between each input bonding pad and its receiver circuit and includes folded portions for adding to the length of the signal line to form a high frequency inductor to protect the receiver circuit at the onset of an overvoltage event before clamping becomes effective.

REFERENCES:
patent: 4819047 (1989-04-01), Gilfeather et al.
patent: 5173755 (1992-12-01), Co et al.
patent: 5237395 (1993-08-01), Lee
patent: 5641981 (1997-06-01), Isono et al.

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