Integrated circuit with improved interconnect structure and...

Details Integrated circuit with improved interconnect structure and... Integrated circuit with improved interconnect structure and...

2007-02-20

2007-02-20

Clark, S. V. (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S672000

Reexamination Certificate

active

11029193

ABSTRACT:
A semiconductor die and an associated low resistance interconnect located primarily on the bottom surface of such die is disclosed. This arrangement provides a flexible packaging structure permitting easy interconnected with other integrated circuits; in this manner, a number of such circuits can be stacked to create high circuit density multi-chip modules. A process for making the device is further disclosed. To preserve structural integrity of a wafer containing such die during manufacturing, a through-hole via formed as part of the interconnect is filled with an inert material during operations associated with subsequent active device formation on such die.

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