Integrated circuit wafer comprising unsingulated dies, and decod

Details Integrated circuit wafer comprising unsingulated dies, and decod Integrated circuit wafer comprising unsingulated dies, and decod

1994-09-14

1997-07-15

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Test or calibration structure

257208, 257620, 257665, H01L 2358, H01L 2710, H01L 23528

Patent

active

056486618

ABSTRACT:
Unsingulated dies on a wafer may be individually electronically selected using various "electronic mechanisms" on the wafer. Conductive lines extend on the wafer from the electronic mechanism to the individual dies. The conductive lines may be provided in sets of two or more, such as for providing discrete power and ground connections from the external equipment to the individual dies. Redundant conductive lines may be provided to ensure against "open" faults. Diode and/or fuses may also be provided in conjunction with the conductive lines to ensure against leakages and shorts. Redundant electronic selection mechanisms may also be provided.

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