Integrated circuit underfill reservoir

Details Integrated circuit underfill reservoir Integrated circuit underfill reservoir

1996-05-07

1998-07-14

Ostrowski, David

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With dam or vent for encapsulant

257687, 257787, 438124, 438126, 438127, H01L 23495

Patent

active

057809240

ABSTRACT:
A method of packaging an integrated circuit. An integrated circuit is connected to a substrate. A reservoir body is applied to the substrate, and the reservoir body and substrate define at least one reservoir and at least one flow gate. The reservoir body, substrate, and integrated circuit define a flow ring which extends at least partially around the circumference of the integrated circuit. A compound is dispensed into the reservoirs, and is flowed through the flow gates and into the flow ring, underfilling the integrated circuit.

REFERENCES:
patent: 4556896 (1985-12-01), Meddles
patent: 4611398 (1986-09-01), Eames et al.
patent: 4803544 (1989-02-01), Holzschuh et al.
patent: 5278446 (1994-01-01), Nagaraj et al.
patent: 5302850 (1994-04-01), Hara
patent: 5371044 (1994-12-01), Yoshida et al.
patent: 5583370 (1996-12-01), Higgins, III et al.

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