Integrated circuit system employing dipole multiple exposure

Details Integrated circuit system employing dipole multiple exposure Integrated circuit system employing dipole multiple exposure

2011-04-12

2011-04-12

Lee, Eugene (Department: 2815)

Computer-aided design and analysis of circuits and semiconductor

Nanotechnology related integrated circuit design

C716S030000, C430S311000, C430S394000, C430S396000, C250S492200

Reexamination Certificate

active

07926000

ABSTRACT:
An integrated circuit system that includes: providing a first mask including a first feature; exposing the first mask to a radiation source to form an image of the first feature on a photoresist material that is larger than a structure to be formed, the photoresist material being formed over a substrate that includes the integrated circuit system; providing a second mask including a second feature; aligning the second mask over the image of the first mask to form an overlap region; and exposing the second mask to the radiation source to form an image of the second feature on the photoresist material that is larger than the structure to be formed.

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