Integrated circuit substrate having laser-exposed terminals

Details Integrated circuit substrate having laser-exposed terminals Integrated circuit substrate having laser-exposed terminals

2006-04-18

2006-04-18

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S832000, C029S840000, C427S096100, C427S097100

Reexamination Certificate

active

07028400

ABSTRACT:
An integrated circuit substrate having laser-exposed terminals provides a high-density and low cost mounting and interconnect structure for integrated circuits. The laser-exposed terminals can further provide a selective plating feature by using a dielectric layer of the substrate to prevent plating terminal conductors and subsequently exposing the terminals via laser ablation. A metal layer may be coated on one or both sides with a dielectric material, conductive material embedded within the dielectric to form conductive interconnects and then coating over the conductive material with a conformal protective coating. The protectant is then laser-ablated to expose the terminals. A dielectric film having a metal layer laminated on one side may be etched and plated. Terminals are then laser-exposed from the back side of the metal layer exposing unplated terminals.

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