Integrated circuit substrate having embedded passive...

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C361S329000, C257S419000, C257S704000, C338S221000

Reexamination Certificate

active

06987661

ABSTRACT:
An integrated circuit substrate having embdedded passive components provides a reduced cost and compact package for a die and one or more passive components. An insulating layer of the substrate is embossed or laser-ablated to generate apertures for insertion of a paste forming the body of the passive component. A resistive paste is used to form resistors and a dielectric paste is used for forming capacitors. A capacitor plate may be deposited at a bottom of the aperture by using a doped substrate material and activating only the bottom wall of the aperture, enabling plating of the bottom wall without depositing conductive material on the side walls of the aperture. Vias may be formed to the bottom plate by using a disjoint structure and conductive paste technology. Connection to the passive components may be made by conductive paste-filled channels forming conductive patterns on the substrate.

REFERENCES:
patent: 3916434 (1975-10-01), Garboushian
patent: 4322778 (1982-03-01), Barbour et al.
patent: 4685033 (1987-08-01), Inoue
patent: 4786952 (1988-11-01), MacIver et al.
patent: 4811082 (1989-03-01), Jacobs et al.
patent: 5021047 (1991-06-01), Movern
patent: 5072075 (1991-12-01), Lee et al.
patent: 5191174 (1993-03-01), Chang et al.
patent: 5229550 (1993-07-01), Bindra et al.
patent: 5239448 (1993-08-01), Perkins et al.
patent: 5283459 (1994-02-01), Hirano et al.
patent: 5404044 (1995-04-01), Booth et al.
patent: 5508938 (1996-04-01), Wheeler
patent: 5616422 (1997-04-01), Ballard et al.
patent: 5774340 (1998-06-01), Chang et al.
patent: 6081036 (2000-06-01), Hirano et al.
patent: 6239485 (2001-05-01), Peters et al.
patent: 6365975 (2002-04-01), DiStefano et al.
patent: 6727645 (2004-04-01), Tsujimura et al.
patent: 9311589 (1993-11-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Integrated circuit substrate having embedded passive... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit substrate having embedded passive..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit substrate having embedded passive... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3553811

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.