Integrated circuit structure having two photoresist layers

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

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430 9, 430 11, 430 12, 430 16, 430313, 430318, 430311, 430312, 430329, 430333, G03C 500

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058691758

ABSTRACT:
A structure formed during processing of an integrated circuit. Two layers of photoresist are formed over a conductive layer to be patterned. The lower layer is thinner than the upper layer, and is dyed to have a lower transmittance. Both layers are used as a masking pattern for the underlying conductive layer.

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Keller, Solid State Technology, "Functional Testing of Positive Photoresist for Manufacture of Film Integrated Circuits", Jun. 1987, pp. 45-53.
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Listvan et al., SPIE, "Multiple Layer Techniques in Optical Lithography: Applications to Fine Line Mos Production", vol. 470, 1984, pp. 85-90.

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