Integrated circuit structure analysis

Radiant energy – Inspection of solids or liquids by charged particles – Electron probe type

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250307, 250397, H01J 3728, H01J 3730

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active

051912139

ABSTRACT:
The structure of a multilayered integrated circuit is determined by removing successive layers of the circuit. Following removal of each layer, the revealed surface is scanned by an electron beam. The intensity of backscattered or secondary electrons is detected by a first or second detector respectively. From the detected electron intensities, image processing circuitry derives a representation of the integrated circuit surface scanned. Where the surface of the integrated circuit is a flat layer of semiconductor substrate material having implanted doped areas, the surface is covered with a metallisation layer providing a Schottky barrier junction with the doped areas. Electron beam scanning of the metallisation layer induces a current at this junction which is monitored and processed to derive a representation of the outline of the doped implanted areas.

REFERENCES:
patent: 4438332 (1984-03-01), Lichtenegger
patent: 4566937 (1986-01-01), Pitts
patent: 4646253 (1987-02-01), Rehme et al.
patent: 4712057 (1987-12-01), Pau
patent: 4755748 (1988-07-01), Lin
patent: 4794646 (1988-12-01), Takeuchi et al.
patent: 4871911 (1989-10-01), Van Gorkom et al.
patent: 4933565 (1990-06-01), Yamaguchi et al.

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