Integrated circuit scribe line structures and methods for making

Details Integrated circuit scribe line structures and methods for making Integrated circuit scribe line structures and methods for making

1996-08-19

1998-08-18

Niebling, John

Semiconductor device manufacturing: process

Semiconductor substrate dicing

Having specified scribe region structure

H01L 21301

Patent

active

057958157

ABSTRACT:
A method for forming a scribe line on a semiconductor wafer including the steps of: (a) providing a semiconductor substrate; and (b) sequentially providing a plurality of layers over the semiconductor substrate of alternating conductive and insulating types, where each of the layers is provided with an elongated opening is formed relative to a desired scribe line position, and where the openings of at least some of the plurality of layers are wider than openings of preceding layers such that at least one sidewall of a completed scribe line has a pronounced slope extending outwardly from its base. The structure of the present invention is, therefore, a scribe line having sloped sidewalls that greatly reduces scribe line contamination problems and enhances planarization during subsequent spin-on-material processes. The scribe lines can either be elongated openings in the layers, or an elongated mesa formed in the layers.

REFERENCES:
patent: 5017512 (1991-05-01), Takagi
patent: 5300816 (1994-04-01), Lee

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