Integrated circuit power distribution system

Details Integrated circuit power distribution system Integrated circuit power distribution system

1991-11-29

1994-05-10

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257692, H01L 2348, H01L 2344, H01L 2352, H01L 2360

Patent

active

053110587

ABSTRACT:
A power distribution system for distributing power to an IC is formed by attaching a grid having at least one power bus and one ground bus to the top surface of the IC die. The grid is adapted to be electrically coupled with power and ground pins in the IC's package The grid has an insulative layer on its bottom surface to electrically isolate the grid's bottom surface from the IC. The grid is adapted to cover substantially the entire top surface of the IC and to be electrically coupled directly from the top surface of the grid to terminal or connection points on the top surface of the IC. The connection points can be distributed throughout the IC to reduce the area of metallization in the IC and the path length the current from the power busses must traverse.

REFERENCES:
patent: 4751482 (1988-06-01), Fukuta et al.
patent: 4811082 (1989-03-01), Jacobs et al.
patent: 5119169 (1992-06-01), Kozono et al.

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