Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2009-05-27
2011-12-20
Richards, N Drew (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C257SE23133
Reexamination Certificate
active
08080446
ABSTRACT:
A method of manufacture of an integrated circuit packaging system includes: providing an integrated circuit; mounting a routing structure having a functional side above the integrated circuit; mounting a vertical interconnect to the functional side of the routing structure and the vertical interconnect extending vertically away from the routing structure; and forming an encapsulation that encapsulates the integrated circuit, the routing structure.
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Choi A Leam
Lee Kenny
Shin HanGil
Yoon In Sang
Ishimaru Mikio
Richards N Drew
Shook Daniel
STATS ChipPAC Ltd.
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