Integrated circuit packaging system with exposed conductor...

Details Integrated circuit packaging system with exposed conductor... Integrated circuit packaging system with exposed conductor...

2010-02-26

2011-11-29

Lee, Cheung (Department: 2812)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S106000, C438S107000, C438S127000, C257SE21499, C257SE21502, C257SE21508

Reexamination Certificate

active

08067306

ABSTRACT:
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; forming a component connector on the substrate; forming a resist layer on the substrate with the component connector exposed; forming a vertical insertion cavity in the resist layer, the vertical insertion cavity isolated from the component connector or a further vertical insertion cavity, the vertical insertion cavity having a cavity side that is orthogonal to the substrate; forming a rounded interconnect in the vertical insertion cavity, the rounded interconnect nonconformal to the vertical insertion cavity; and mounting an integrated circuit device on the component connector.

REFERENCES:
patent: 5924623 (1999-07-01), Kenney
patent: 6238952 (2001-05-01), Lin
patent: 7345361 (2008-03-01), Mallik et al.
patent: 7642133 (2010-01-01), Wu et al.
patent: 7653991 (2010-02-01), Mok et al.
patent: 7714453 (2010-05-01), Khan et al.
patent: 2006/0040423 (2006-02-01), Savastibuk et al.
patent: 2007/0190690 (2007-08-01), Chow et al.
patent: 2007/0273049 (2007-11-01), Khan et al.
patent: 2008/0073769 (2008-03-01), Wu et al.
patent: 2008/0258289 (2008-10-01), Pendse et al.
patent: 2009/0250810 (2009-10-01), Pendse
patent: 2010/0000775 (2010-01-01), Shen et al.
U.S. Appl. No. 12/714,291, filed Feb. 26, 2010, Shim et al.

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