Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-09-05
2006-09-05
Edmondson, Lynne R. (Department: 1725)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S613000, C228S123100, C228S180220
Reexamination Certificate
active
07101781
ABSTRACT:
This invention relates to an integrated circuit package and a method for the same, especially relates to the integrated circuit package without a solder mask and the method for the same. A solder wettable metal is used as the material of the first solder pad and a non-wettable insulating layer is formed on the top surface and sidewalls of the metal layer, which is not solder pads, in the integrated circuit packages without a solder mask of the present invention to avoid short circuit defects and to increase a circuit density and reliability of the integrated circuit packages.
REFERENCES:
patent: 3771217 (1973-11-01), Hartman
patent: 3801880 (1974-04-01), Harada et al.
patent: 4736521 (1988-04-01), Dohya
patent: 4755866 (1988-07-01), Marshall et al.
patent: 5083187 (1992-01-01), Lamson et al.
patent: 5208066 (1993-05-01), Fujisaki et al.
patent: 5449955 (1995-09-01), Debiec et al.
patent: 5707902 (1998-01-01), Chang et al.
patent: 5841190 (1998-11-01), Noda et al.
patent: 6130149 (2000-10-01), Chien et al.
patent: 6140707 (2000-10-01), Plepys et al.
patent: 6165885 (2000-12-01), Gaynes et al.
patent: 6169329 (2001-01-01), Farnworth et al.
patent: 6174824 (2001-01-01), Michael et al.
patent: 6232238 (2001-05-01), Chang et al.
patent: 6383720 (2002-05-01), Nakashima et al.
patent: 6406939 (2002-06-01), Lin
patent: 6414849 (2002-07-01), Chiu
patent: 6472239 (2002-10-01), Hembree et al.
patent: 6569712 (2003-05-01), Ho et al.
patent: 6780673 (2004-08-01), Venkateswaran
patent: 6787916 (2004-09-01), Halahan
patent: 2001/0013653 (2001-08-01), Shoji
patent: 2002/0090804 (2002-07-01), McTeer
patent: 2003/0037959 (2003-02-01), Master et al.
patent: 2003/0132025 (2003-07-01), Wakihara et al.
patent: 2003/0170450 (2003-09-01), Stewart et al.
patent: 2003/0211425 (2003-11-01), Mao et al.
patent: 2003/0218249 (2003-11-01), Ho et al.
patent: 2004/0164414 (2004-08-01), Venkateswaran
patent: 2004/0166659 (2004-08-01), Lin et al.
Ho Kun-Yao
Kung Moriss
Edmondson Lynne R.
Rosenberg , Klein & Lee
Via Technologies Inc.
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