Integrated circuit packaged for receiving another integrated cir

Details Integrated circuit packaged for receiving another integrated cir Integrated circuit packaged for receiving another integrated cir

1998-03-24

2000-02-01

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

257678, 257693, 257700, 257704, H01L 2348, H01L 2334, H01L 2312

Patent

active

060206330

ABSTRACT:
An integrated circuit combination includes a second piggy-back small integrated circuit chip mounted on the carrier of a first integrated circuit chip. The combination can be mounted on a board without requiring board space for interconnecting the first and second chips. The lid of the first chip is cut away so that the second chip can be mounted to the first without increasing the height of the combination over the height of the first chip. The two chips preferably comprise an FPGA and a PROM for programming the FPGA. The combination increases security as well as reducing board space because it is difficult to read a bitstream being transmitted from the PROM to the FPGA when the PROM is directly mounted on the FPGA.

REFERENCES:
patent: 5212403 (1993-05-01), Nakanishi et al.
patent: 5598033 (1997-01-01), Behlen et al.
patent: 5646828 (1997-07-01), Degani et al.
patent: 5652466 (1997-07-01), Hirakawa et al.

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