Integrated circuit package with rectangular contact pads

Details Integrated circuit package with rectangular contact pads Integrated circuit package with rectangular contact pads

1998-06-25

2000-09-12

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

257774, 257734, 257778, 257779, 257780, 257786, 438612, 438613, H01L 2348

Patent

active

06118182&

ABSTRACT:
An integrated circuit package which has a substrate that has a plurality of rectangular contact pads. Solder balls are attached to the contact pads of the substrate. The solder balls are reflowed to create solder joints which attach the substrate to a printed circuit board. The rectangular shape of the contact pads will induce a rectangular shape in the solder joints. The longitudinal axis of the contact pads and resultant solder joints may be aligned with the axes of expansion/contraction of the substrate when the package substrate is subjected to variations in temperature.

REFERENCES:
patent: 5001829 (1991-03-01), Schelboen
patent: 5444303 (1995-08-01), Greenwood et al.
patent: 5471090 (1995-11-01), Deutsch et al.
patent: 5477082 (1995-12-01), Buckley et al.
patent: 5531021 (1996-07-01), Kolman et al.
patent: 5784262 (1998-07-01), Sherman

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