Integrated circuit package with integral heating circuit

Details Integrated circuit package with integral heating circuit Integrated circuit package with integral heating circuit

1982-07-06

1985-12-24

James, Andrew J.

357 74, 357 75, H01L 2148, H01L 2314, H01L 2318, H01L 2334

Patent

active

045610061

ABSTRACT:
An integrated circuit package having an auxiliary heating element incorporated therein is described. The integral heating element is accessible for application of electric power from an external source to cause heating of the integral circuit package to a predetermined level at which solder will melt and flow, thereby allowing removal and reinsertion of the integrated circuit package with relationship to associated pins in a support assembly. The integral heating element provides a means for applying controlled heat to the integrated circuit package such that the package can be unsoldered from or soldered to associated electrical interconnection pins, some of which may be hidden from view or physical access.

REFERENCES:
patent: 3289046 (1966-11-01), Carr
patent: 3419767 (1968-12-01), Dahlberg
patent: 3444399 (1969-05-01), Jones
patent: 3551645 (1970-12-01), Stoll
patent: 4107019 (1978-08-01), Takao et al.
patent: 4232212 (1980-11-01), Baraff et al.

Affiliated with

Also associated with

Rating

Integrated circuit package with integral heating circuit does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit package with integral heating circuit, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit package with integral heating circuit will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1482515