Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate
2001-06-12
2002-07-16
Reichard, Dean A. (Department: 2831)
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
C174S050510, C257S666000, C257S784000, C257S786000
Reexamination Certificate
active
06420651
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an integrated circuit package.
2. Background Information
Integrated circuits are typically assembled into a package that is soldered to a printed circuit board. There are many types of integrated circuit packages including ball grid array (BGA) packages. BGA packages include a plurality of solder balls that are attached to a substrate. The solder balls are eventually reflowed to mount the package to a printed circuit board.
An integrated circuit is mounted to the BGA package substrate and typically wire bonded to bond pads of the substrate. The bonded integrated circuit and substrate are then placed into a mold that is injected with a plastic material. The injected plastic encloses both the integrated circuit and the bond wires.
FIG. 1
shows a typical wire bonded BGA package which has a number of wire bonds
1
that couple an integrated circuit
2
to a substrate
3
before the injection of plastic. The plastic is typically introduced through a gate at the corner(s) of the integrated circuit. The plastic is injected into the mold at very high pressures to insure that the integrated circuit is completely encapsulated.
As shown in
FIG. 2
, it has been found that the injected plastic
4
creates a “wire sweep” in the bond wires
1
. A significant wire sweep can break the bond wires and create a defective part. It would be desirable to provide an injection molded wire bonded package that is less susceptible to wire sweep than packages in the prior art.
SUMMARY OF THE INVENTION
An integrated circuit package which has an integrated circuit mounted to a substrate. The package includes a plurality of bond wires that couple bond pads of the integrated circuit to corresponding bond pads of the substrate. The bond wires may have an essentially uniform bond wire density about an entire outer perimeter of the integrated circuit. The integrated circuit and bond wires are enclosed by a housing.
REFERENCES:
patent: 4258381 (1981-03-01), Inaba
patent: 4928162 (1990-05-01), Lesk et al.
patent: 5045919 (1991-09-01), Nagaoka
patent: 5296743 (1994-03-01), Nguyen et al.
patent: 5457340 (1995-10-01), Templeton, Jr. et al.
patent: 5508556 (1996-04-01), Lin
patent: 5563446 (1996-10-01), Chia et al.
patent: 5565709 (1996-10-01), Fukushima et al.
patent: 5596227 (1997-01-01), Saito
patent: 5684332 (1997-11-01), Chen et al.
patent: 5780772 (1998-07-01), Singh et al.
patent: 5843808 (1998-12-01), Karnezos
patent: 6005293 (1999-12-01), Mori
patent: 6297078 (2001-10-01), Barrow
Blakely , Sokoloff, Taylor & Zafman LLP
Intel Corporation
Oliva Carmelo
Reichard Dean A.
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