Integrated circuit package to provide high-bandwidth...

Details Integrated circuit package to provide high-bandwidth... Integrated circuit package to provide high-bandwidth...

2005-12-21

2008-03-25

Chambliss, Alonzo (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S777000, C257S778000, C438S108000, C228S180220

Reexamination Certificate

active

07348678

ABSTRACT:
A system may include a microprocessor die, an integrated circuit package substrate, and a die disposed between the microprocessor die and the integrated circuit package substrate. In some embodiments, the integrated circuit package substrate defines a first cavity, and the die is disposed at least partially within the first cavity.

REFERENCES:
patent: 5198963 (1993-03-01), Gupta et al.
patent: 6100593 (2000-08-01), Yu et al.
patent: 6239484 (2001-05-01), Dore et al.
patent: 7266788 (2007-09-01), Haridass et al.
patent: 2004/0120128 (2004-06-01), Chang
patent: WO8500468 (1985-01-01), None

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