Integrated circuit package system with wire-in-film...

Details Integrated circuit package system with wire-in-film... Integrated circuit package system with wire-in-film...

2011-08-09

2011-08-09

Clark, S. V (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

C257S782000, C257S686000, C438S127000

Reexamination Certificate

active

07994645

ABSTRACT:
An integrated circuit package in package system includes: providing a substrate having a first wire-bonded die with an active side mounted above; connecting the active side of the first wire-bonded die to the substrate with a bond-wire; mounting a wire-in-film adhesive having an isolation barrier over the first wire-bonded die; and encapsulating the first wire-bonded die, the bond-wires, and the wire-in-film adhesive with an encapsulation.

REFERENCES:
patent: 5877478 (1999-03-01), Ando
patent: 6340846 (2002-01-01), LoBianco et al.
patent: 6388313 (2002-05-01), Lee et al.
patent: 6472758 (2002-10-01), Glenn et al.
patent: 6569709 (2003-05-01), Derderian
patent: 6657290 (2003-12-01), Fukui et al.
patent: 6869828 (2005-03-01), Derderian
patent: 6870269 (2005-03-01), Derderian
patent: 6919627 (2005-07-01), Liu et al.
patent: 6977439 (2005-12-01), Kang et al.
patent: 7005577 (2006-02-01), Lee et al.
patent: 7037756 (2006-05-01), Jiang et al.
patent: 7244675 (2007-07-01), Honda et al.
patent: 7629695 (2009-12-01), Yoshimura et al.
patent: 2002/0153615 (2002-10-01), Komiyama et al.
patent: 2005/0205981 (2005-09-01), Yoshimura et al.
patent: 2005/0224959 (2005-10-01), Kwon et al.
patent: 2005/0258545 (2005-11-01), Kwon
patent: 2007/0052089 (2007-03-01), Kim et al.
patent: 2008/0017968 (2008-01-01), Choi et al.
patent: 2010/0123236 (2010-05-01), Kang
patent: 08-106818 (1996-04-01), None

Affiliated with

Also associated with

Rating

Integrated circuit package system with wire-in-film... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit package system with wire-in-film..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit package system with wire-in-film... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2619080