Integrated circuit package system with mold lock subassembly

Details Integrated circuit package system with mold lock subassembly Integrated circuit package system with mold lock subassembly

2007-09-30

2010-02-23

Mandala, Victor A (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Housing or package filled with solid or liquid electrically...

C257S686000, C257S725000, C257SE23116, C438S109000, C438S126000, C438S127000

Reexamination Certificate

active

07667314

ABSTRACT:
An integrated circuit package system includes: providing a substrate; attaching an integrated circuit over the substrate; attaching an integrated circuit subassembly system having a perforated interposer over the substrate with the perforated interposer having a slot; and forming a package encapsulation over the integrated circuit subassembly system, the perforated interposer, the integrated circuit, and the substrate with the slot filled with the package encapsulation.

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patent: 7309913 (2007-12-01), Shim et al.
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patent: 2006/0220256 (2006-10-01), Shim et al.
patent: 2007/0194423 (2007-08-01), Yim et al.

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