Integrated circuit package system with leadfinger support

Details Integrated circuit package system with leadfinger support Integrated circuit package system with leadfinger support

2006-02-04

2009-06-02

Parekh, Nitin (Department: 2811)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S108000, C257S666000, C257S673000, C257SE23039

Reexamination Certificate

active

07541221

ABSTRACT:
An integrated circuit package system including forming a leadframe having a lead with a leadfinger support of a predetermined height, and attaching an integrated circuit die with an electrical interconnect at a predetermined collapse height determined by the predetermined height of the leadfinger support.

REFERENCES:
patent: 5099306 (1992-03-01), Dunaway et al.
patent: 5233504 (1993-08-01), Melton et al.
patent: 5492266 (1996-02-01), Hoebener et al.
patent: 6214642 (2001-04-01), Chen et al.
patent: 6337522 (2002-01-01), Kang et al.
patent: 6376921 (2002-04-01), Yoneda et al.
patent: 6482680 (2002-11-01), Khor et al.
patent: 6720642 (2004-04-01), Joshi et al.
patent: 6835580 (2004-12-01), Knapp et al.
patent: 6933607 (2005-08-01), Ono et al.
patent: 2006/0192295 (2006-08-01), Lee et al.

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