Integrated circuit package system with laminate base

Details Integrated circuit package system with laminate base Integrated circuit package system with laminate base

2011-08-09

2011-08-09

Loke, Steven (Department: 2829)

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

C438S014000, C438S107000, C438S109000, C257S686000, C257S777000, C257SE25013

Reexamination Certificate

active

07993939

ABSTRACT:
An integrated circuit package system with laminate base is provided including forming a base package including, forming a laminate substrate strip, mounting an integrated circuit on the laminate substrate strip, forming a molded cover over the integrated circuit and the laminate substrate strip, and performing a strip test of the base package; attaching a bare die to the base package; connecting electrically the bare die to the laminate substrate strip; and encapsulating the bare die and the base package.

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patent: 7859120 (2010-12-01), Choi et al.
patent: 2005/0167810 (2005-08-01), Bai et al.
patent: 2006/0220257 (2006-10-01), Lee
patent: 2007/0194424 (2007-08-01), Camacho et al.

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