Integrated circuit package system with interposer

Details Integrated circuit package system with interposer Integrated circuit package system with interposer

2007-12-28

2011-10-11

Stark, Jarrett (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S778000, C257SE23172, C257SE21002, C438S108000, C438S109000

Reexamination Certificate

active

08035210

ABSTRACT:
A method of manufacture of an integrated circuit package system includes: providing a base substrate; coupling a base integrated circuit on the base substrate; forming a double side molded interposer unit over the base integrated circuit including: providing an interposer substrate having an interposer top and an interposer bottom, mounting a first integrated circuit to the interposer bottom and electrically connected thereto, mounting a second integrated circuit to the interposer top and electrically connected thereto, and molding a first chip cover on the first integrated circuit and a second chip cover on the second integrated circuit; and coupling an external component to the double side molded interposer unit.

REFERENCES:
patent: 6153928 (2000-11-01), Cho
patent: 6798057 (2004-09-01), Bolkin et al.
patent: 7217994 (2007-05-01), Zhu et al.
patent: 7247933 (2007-07-01), Juskey et al.
patent: 7288835 (2007-10-01), Yim et al.
patent: 7550832 (2009-06-01), Weng et al.
patent: 2006/0220256 (2006-10-01), Shim et al.
patent: 2007/0229107 (2007-10-01), Kim et al.
patent: 2008/0157325 (2008-07-01), Chow et al.
patent: WO 2007/024483 (2007-03-01), None

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