Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2011-03-08
2011-03-08
Chambliss, Alonzo (Department: 2892)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C257S672000, C257S673000, C257S786000
Reexamination Certificate
active
07901996
ABSTRACT:
An integrated circuit package system with interconnect support is provided including providing an integrated circuit, forming an electrical interconnect on the integrated circuit, forming a contact pad having a chip support, and coupling the integrated circuit to the contact pad by the electrical interconnect, with the integrated circuit on the chip support.
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Bathan Henry Descalzo
Camacho Zigmund Ramirez
Punzalan Jeffrey D.
Shim Il Kwon
Chambliss Alonzo
Ishimaru Mikio
Stats Chippac Ltd.
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