Integrated circuit package system with integrated circuit...

Details Integrated circuit package system with integrated circuit... Integrated circuit package system with integrated circuit...

2008-09-02

2008-09-02

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S670000, C257S674000, C257S778000, C257S783000, C257SE23031, C257SE23037, C257SE23040, C257SE23043

Reexamination Certificate

active

11164321

ABSTRACT:
An integrated circuit package system including an integrated circuit die, a leadframe and an integrated circuit support. The integrated circuit support between the integrated circuit die and the leadframe with the electrical interconnects connected to the leadframe.

REFERENCES:
patent: 6342443 (2002-01-01), Tao et al.
patent: 6429046 (2002-08-01), Marlin
patent: 6507121 (2003-01-01), Huang
patent: 6781245 (2004-08-01), Huang
patent: 6787921 (2004-09-01), Huang
patent: 6864423 (2005-03-01), Tan et al.
patent: 2007/0099348 (2007-05-01), Sharma et al.

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