Integrated circuit package system with flexible substrate...

Details Integrated circuit package system with flexible substrate... Integrated circuit package system with flexible substrate...

2008-06-09

2011-11-01

Chervinsky, Boris L (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S749000, C361S760000, C361S767000, C361S770000, C361S772000, C174S254000, C174S255000, C257S684000, C257S686000

Reexamination Certificate

active

08050047

ABSTRACT:
An integrated circuit package system includes: providing a flexible circuit substrate having a fold; mounting an integrated circuit or an integrated circuit package over the flexible circuit substrate and connected to the flexible circuit substrate with interconnects; and encapsulating the integrated circuit or integrated circuit package with a recessed encapsulation having a first level and a second level, the second level having the flexible circuit substrate folded thereover.

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