Integrated circuit package system with flexible substrate...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S749000, C361S760000, C361S767000, C361S770000, C361S772000, C174S254000, C174S255000, C257S684000, C257S686000

Reexamination Certificate

active

08031475

ABSTRACT:
An integrated circuit package system includes: providing a flexible circuit substrate; mounting an integrated circuit or an integrated circuit package over the flexible circuit substrate and connected to the flexible circuit substrate with interconnects; and encapsulating the integrated circuit or integrated circuit package with a mounded encapsulation having a first level and a second level, the second level having the flexible circuit substrate folded thereover.

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