Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-06-09
2011-10-04
Chervinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S749000, C361S760000, C361S767000, C361S770000, C361S772000, C174S254000, C174S255000, C257S684000, C257S686000
Reexamination Certificate
active
08031475
ABSTRACT:
An integrated circuit package system includes: providing a flexible circuit substrate; mounting an integrated circuit or an integrated circuit package over the flexible circuit substrate and connected to the flexible circuit substrate with interconnects; and encapsulating the integrated circuit or integrated circuit package with a mounded encapsulation having a first level and a second level, the second level having the flexible circuit substrate folded thereover.
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Chow Seng Guan
Han Byung Joon
Ramakrishna Kambhampati
Shim Il Kwon
Chervinsky Boris
Ishimaru Mikio
Stats ChipPAC, Ltd.
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