Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2008-03-27
2010-12-21
Chambliss, Alonzo (Department: 2892)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S109000, C438S127000, C257S686000, C257S724000, C257S787000, C257SE25013, C257SE23145, C361S758000, C361S790000, C361S792000
Reexamination Certificate
active
07855100
ABSTRACT:
An encapsulant cavity integrated circuit package system including forming a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and an interposer, and attaching a component on the interposer in the encapsulant cavity.
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pat
Chow Seng Guan
Han Byung Joon
Ramakrishna Kambhampati
Shim Il Kwon
Chambliss Alonzo
Ishimaru Mikio
Stats Chippac Ltd.
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