Integrated circuit package system including stacked die

Details Integrated circuit package system including stacked die Integrated circuit package system including stacked die

2006-01-04

2008-11-25

Potter, Roy K (Department: 2822)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257S737000

Reexamination Certificate

active

07456088

ABSTRACT:
An integrated circuit package system is provided including providing a wafer with bond pads formed on the wafer. A solder bump is deposited on one or more bond pads. The bond pads and the solder bump are embedded within a mold compound formed on the wafer. A groove is formed in the mold compound to expose a portion of the solder bump. The wafer is singulated into individual die structures at the groove.

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